Systems and methods for mitigating crack propagation in semiconductor die manufacturing
US-12347732-B2 · Jul 1, 2025 · US
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Kaur Sukhdeep patents
Kaur Sukhdeep is listed as an inventor on 4 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kaur Sukhdeep |
| Total patents | 4 |
| First publication | Jun 30, 2022 |
| Latest publication | Jul 1, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Systems and methods for mitigating crack propagation in semiconductor die manufacturing
US-2023260840-A1 · Aug 17, 2023 · US
Systems and methods for mitigating crack propagation in semiconductor die manufacturing
US-11637040-B2 · Apr 25, 2023 · US
Systems and methods for mitigating crack propagation in semiconductor die manufacturing
US-2022208609-A1 · Jun 30, 2022 · US
Recent patents
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Micron Technology Inc | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/00 | 4 |
| H10W42/121 | 4 |
| H10P54/00 | 4 |
| H10P50/695 | 4 |
| H10P50/642 | 4 |