Method for fabrication of 3D printed part with high through-plane thermal conductivity
US-11618182-B2 · Apr 4, 2023 · US
Jing Jingjing is listed as an inventor on 2 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Jing Jingjing |
| Total patents | 2 |
| First publication | Jan 12, 2023 |
| Latest publication | Apr 4, 2023 |
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Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Univ Sichuan | 2 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B29B11/10 | 2 |
| B29K2023/0625 | 2 |
| B29B11/16 | 2 |
| B29K2105/167 | 2 |
| B29C64/118 | 2 |