Binding band assembly for headset and headset
US-12581238-B2 · Mar 17, 2026 · US
Jia Wei is listed as an inventor on 50 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Jia Wei |
| Total patents | 50 |
| First publication | Feb 9, 2017 |
| Latest publication | Mar 17, 2026 |
Publications ranked by popularity score, then publication date.
US-12581238-B2 · Mar 17, 2026 · US
US-2026027455-A1 · Jan 29, 2026 · US
US-2026030227-A1 · Jan 29, 2026 · US
US-2026030252-A1 · Jan 29, 2026 · US
US-12532094-B2 · Jan 20, 2026 · US
US-12520066-B2 · Jan 6, 2026 · US
US-2026003845-A1 · Jan 1, 2026 · US
US-12450264-B2 · Oct 21, 2025 · US
US-2025227835-A1 · Jul 10, 2025 · US
US-2025147325-A1 · May 8, 2025 · US
Latest publications not already listed above.
US-2025076597-A1 · Mar 6, 2025 · US
US-12068842-B2 · Aug 20, 2024 · US
US-12055763-B2 · Aug 6, 2024 · US
US-2024241892-A1 · Jul 18, 2024 · US
US-2023421957-A1 · Dec 28, 2023 · US
US-2023403484-A1 · Dec 14, 2023 · US
US-11737202-B2 · Aug 22, 2023 · US
US-11728919-B2 · Aug 15, 2023 · US
US-2023179318-A1 · Jun 8, 2023 · US
US-11627393-B2 · Apr 11, 2023 · US
US-2023100718-A1 · Mar 30, 2023 · US
US-11615242-B2 · Mar 28, 2023 · US
US-2023007371-A1 · Jan 5, 2023 · US
US-2022390681-A1 · Dec 8, 2022 · US
US-11514003-B2 · Nov 29, 2022 · US
US-2022318275-A1 · Oct 6, 2022 · US
US-11343010-B2 · May 24, 2022 · US
US-11316591-B2 · Apr 26, 2022 · US
US-2022052778-A1 · Feb 17, 2022 · US
US-2022019562-A1 · Jan 20, 2022 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Huawei Tech Co Ltd | 15 |
| Nuctech Co Ltd | 15 |
| Univ Tsinghua | 9 |
| Alipay Hangzhou Inf Tech Co Ltd | 7 |
| Beijing Zitiao Network Technology Co Ltd | 4 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H04Q11/0005 | 11 |
| H04J14/0212 | 9 |
| G02B6/356 | 9 |
| H04Q2011/0026 | 7 |
| G02B27/0176 | 6 |