In situ polymerization of para-xylene for production of parylene f-like coating
US-2024216948-A1 · Jul 4, 2024 · US
This page is not indexed by search engines while we improve data quality.
Janik John patents
Janik John is listed as an inventor on 17 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Janik John |
| Total patents | 17 |
| First publication | Feb 10, 2015 |
| Latest publication | Jul 4, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
In situ polymerization of para-xylene for production of parylene F-like coating
US-11938512-B2 · Mar 26, 2024 · US
In situ polymerization of para-xylene for production of parylene f-like coating
US-2021129180-A1 · May 6, 2021 · US
Combination parylene system for pre-treatment, deposition, post-treatment and cleaning
US-2021129178-A1 · May 6, 2021 · US
Laser ablation for coated devices
US-2021060699-A1 · Mar 4, 2021 · US
Method of assembling an electrode array that includes a plastically deformable carrier
US-10780262-B2 · Sep 22, 2020 · US
Method of fabricating implantable medical devices from a polymer coupon that is bonded to a rigid substrate
US-10756043-B2 · Aug 25, 2020 · US
Plasma ashing of coated substrates
US-2020126769-A1 · Apr 23, 2020 · US
Implantable electrode array assembly with an array substrate, electrodes and integrated circuits, the integrated circuits being attached to package substrates
US-10046158-B2 · Aug 14, 2018 · US
Method of manufacturing an implantable electrode array by forming packages around the array control modules after the control modules are bonded to substrates
US-9950154-B2 · Apr 24, 2018 · US
Recent patents
Latest publications not already listed above.
Methiod of manufacturing an implantable electrode array by forming packages around the array control modules after the control modules are bonded to substrates
US-2018008818-A1 · Jan 11, 2018 · US
Method of fabricating implantable medical devices from a polymer coupon that is bonded to a rigid substrate
US-2017367652-A1 · Dec 28, 2017 · US
Implantable electrode array assembly including a carrier with embedded control modules contained in packages, the packages extending outwardly so as to extend over the carrier
US-9770582-B2 · Sep 26, 2017 · US
Method of fabricating implantable medical devices from a polymer coupon that is bonded to rigid substrate
US-9700262-B2 · Jul 11, 2017 · US
Method of assembling an electrode array that includes a plastically deformable carrier
US-2015352350-A1 · Dec 10, 2015 · US
Method of fabricating implantable medical devices from a polymer coupon that is bonded to rigid substrate
US-2015150504-A1 · Jun 4, 2015 · US
Method of fabricating an implantable medical device that includes one or more thin film polymer support layers
US-8951426-B2 · Feb 10, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Stryker Corp | 11 |
| Hzo Inc | 5 |
| Hzo Inc | 1 |
| Janik John | 1 |
| Brindley Rob | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| A61N1/05 | 10 |
| A61N1/0553 | 9 |
| H10W70/09 | 8 |
| H01L24/19 | 6 |
| H10W70/614 | 5 |