Formation method of chip package
US-2018047703-A1 · Feb 15, 2018 · US
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Hu Hsien Pin patents
Hu Hsien Pin is listed as an inventor on 2 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hu Hsien Pin |
| Total patents | 2 |
| First publication | Feb 8, 2018 |
| Latest publication | Feb 15, 2018 |
Notable patents
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Recent patents
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/724 | 2 |
| H10W90/722 | 2 |
| H10W90/701 | 2 |
| H10W90/401 | 2 |
| H10W90/297 | 2 |