Bootloader failure analysis of memory system
US-2026030089-A1 · Jan 29, 2026 · US
Hong Da is listed as an inventor on 10 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hong Da |
| Total patents | 10 |
| First publication | Apr 21, 2022 |
| Latest publication | Jan 29, 2026 |
Publications ranked by popularity score, then publication date.
US-2026030089-A1 · Jan 29, 2026 · US
US-2025335284-A1 · Oct 30, 2025 · US
US-12450115-B2 · Oct 21, 2025 · US
US-2024427657-A1 · Dec 26, 2024 · US
US-11726873-B2 · Aug 15, 2023 · US
US-11720438-B2 · Aug 8, 2023 · US
US-2023195568-A1 · Jun 22, 2023 · US
US-2023163417-A1 · May 25, 2023 · US
US-2022318087-A1 · Oct 6, 2022 · US
US-2022123396-A1 · Apr 21, 2022 · US
Latest publications not already listed above.
No data yet.
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Micron Technology Inc | 8 |
| Huawei Tech Co Ltd | 2 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G06F11/073 | 6 |
| G06F11/0787 | 6 |
| G06F11/0793 | 5 |
| G06F11/0772 | 5 |
| G06F11/0727 | 3 |