Package comprising an acoustic device and a cap substrate comprising an inductor
US-12549154-B2 · Feb 10, 2026 · US
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Hofer Manuel patents
Hofer Manuel is listed as an inventor on 14 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hofer Manuel |
| Total patents | 14 |
| First publication | May 2, 2019 |
| Latest publication | Feb 10, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Acoustic filter device including an acoustic filter and one or more integrated passive devices
US-2025379557-A1 · Dec 11, 2025 · US
Vertically coupled saw resonators
US-2025317122-A1 · Oct 9, 2025 · US
Package comprising an acoustic device and a polymer cap layer
US-12341488-B2 · Jun 24, 2025 · US
Multi-level stacked acoustic wave (AW) filter packages and related fabrication methods
US-12334909-B2 · Jun 17, 2025 · US
Vertically coupled SAW resonators
US-12316304-B2 · May 27, 2025 · US
Stacked acoustic wave (AW) filter packages, including cross-talk reduction layers, and related fabrication methods
US-12261583-B2 · Mar 25, 2025 · US
Vertically coupled saw resonators
US-2024213958-A1 · Jun 27, 2024 · US
Package comprising an acoustic device and a polymer cap layer
US-2024097648-A1 · Mar 21, 2024 · US
Stacked acoustic wave (aw) filter packages, including cross-talk reduction layers, and related fabrication methods
US-2023253950-A1 · Aug 10, 2023 · US
Recent patents
Latest publications not already listed above.
Package comprising an acoustic device and a cap substrate comprising an inductor
US-2023101228-A1 · Mar 30, 2023 · US
Multi-level stacked acoustic wave (aw) filter packages and related fabrication methods
US-2023090842-A1 · Mar 23, 2023 · US
Integration of through glass via (TGV) filter and acoustic filter
US-10582609-B2 · Mar 3, 2020 · US
Integration of through glass via (tgv) filter and acoustic filter
US-2019132942-A1 · May 2, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Qualcomm Inc | 5 |
| Rf360 Singapore Pte Ltd | 5 |
| RF360 Europe GmbH | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H03H9/1071 | 13 |
| H03H3/08 | 11 |
| H03H9/1092 | 11 |
| H03H9/0547 | 9 |
| H03H9/1014 | 8 |