Integrated circuit package assembly comprising a stack of slanted integrated circuit packages
US-10321580-B2 · Jun 11, 2019 · US
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Heller Ralph patents
Heller Ralph is listed as an inventor on 6 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Heller Ralph |
| Total patents | 6 |
| First publication | Dec 3, 2015 |
| Latest publication | Jun 11, 2019 |
Notable patents
Publications ranked by popularity score, then publication date.
Integrated Circuit Package Assembly Comprising a Stack of Slanted Integrated Circuit Packages
US-2018035544-A1 · Feb 1, 2018 · US
Method of forming a printed circuit board assembly
US-9832874-B2 · Nov 28, 2017 · US
Assembly of printed circuit boards
US-9414493-B2 · Aug 9, 2016 · US
Assembly of printed circuit boards
US-2015351242-A1 · Dec 3, 2015 · US
Assembly of printed circuit boards
US-2015351256-A1 · Dec 3, 2015 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 6 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K3/368 | 6 |
| H05K2201/10159 | 6 |
| H01R12/73 | 4 |
| H05K1/117 | 4 |
| H05K2201/041 | 4 |