Modular interconnect for an integrated circuit device
US-2025165692-A1 · May 22, 2025 · US
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Hegde Subramanya patents
Hegde Subramanya is listed as an inventor on 5 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hegde Subramanya |
| Total patents | 5 |
| First publication | Nov 3, 2016 |
| Latest publication | May 22, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Glycoengineered binding protein compositions
US-2018298093-A1 · Oct 18, 2018 · US
Glycoengineered binding protein compositions
US-2017306010-A1 · Oct 26, 2017 · US
Glycoengineered binding protein compositions
US-9550826-B2 · Jan 24, 2017 · US
Glycoengineered binding protein compositions
US-2016319010-A1 · Nov 3, 2016 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Abbvie Inc | 4 |
| Xilinx Inc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C07K2317/77 | 4 |
| A61K2039/505 | 4 |
| C07K16/00 | 4 |
| C07K2317/21 | 4 |
| C07K2317/52 | 4 |