Directional selective fill for silicon gap fill processes
US-2026047365-A1 · Feb 12, 2026 · US
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Hatakeyama Taiki patents
Hatakeyama Taiki is listed as an inventor on 15 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hatakeyama Taiki |
| Total patents | 15 |
| First publication | Mar 17, 2020 |
| Latest publication | Feb 12, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Directional selective fill for silicon gap fill processes
US-12476105-B2 · Nov 18, 2025 · US
Multizone flow distribution system
US-12467139-B2 · Nov 11, 2025 · US
Control of silicon nitride topology at trench bottom
US-2025254969-A1 · Aug 7, 2025 · US
Deposition and etching for selective removal of deposited dielectric film from tops of fins
US-2025253156-A1 · Aug 7, 2025 · US
Directional selective fill of silicon oxide materials
US-2025022704-A1 · Jan 16, 2025 · US
Directional selective fill for silicon gap fill processes
US-2024234128-A1 · Jul 11, 2024 · US
Methods and apparatus for in-situ protection liners for high aspect ratio reactive ion etching
US-11373877-B2 · Jun 28, 2022 · US
Methods and apparatus for etching semiconductor structures
US-11164723-B2 · Nov 2, 2021 · US
Methods and apparatus for in-situ protection liners for high aspect ratio reactive ion etching
US-2021320012-A1 · Oct 14, 2021 · US
Recent patents
Latest publications not already listed above.
Methods and apparatus for etching semiconductor structures
US-2021142987-A1 · May 13, 2021 · US
Methods and apparatus for etching semiconductor structures
US-10930471-B2 · Feb 23, 2021 · US
Multizone flow distribution system
US-2020312680-A1 · Oct 1, 2020 · US
Methods and apparatus for etching semiconductor structures
US-2020294771-A1 · Sep 17, 2020 · US
Methods and apparatus for etching semiconductor structures
US-10593518-B1 · Mar 17, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 15 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P50/283 | 13 |
| H01L21/31116 | 13 |
| H01J37/32449 | 9 |
| H01J2237/3341 | 9 |
| H10P72/0421 | 7 |