Resin composition, cured product, prepreg, metal foil-clad laminate, resin composite sheet, printed wiring board, and semiconductor device
US-2025257214-A1 · Aug 14, 2025 · US
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Futamura Keisuke patents
Futamura Keisuke is listed as an inventor on 4 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Futamura Keisuke |
| Total patents | 4 |
| First publication | Jun 12, 2025 |
| Latest publication | Aug 14, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Resin composition, cured product, prepreg, metal foil-clad laminate, resin composite sheet, printed wiring board, and semiconductor device
US-2025188256-A1 · Jun 12, 2025 · US
Hydroxy resin, styrene resin, method for producing hydroxy resin, method for producing styrene resin, and applications thereof
US-2025188202-A1 · Jun 12, 2025 · US
Resin, resin composition, cured product, prepreg, metal foil-clad laminate, resin composite sheet, printed wiring board, and semiconductor device
US-2025188207-A1 · Jun 12, 2025 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Mitsubishi Gas Chemical Co | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B32B15/08 | 4 |
| C08J5/24 | 4 |
| C08J5/244 | 4 |
| B32B2457/08 | 3 |
| H05K1/03 | 3 |