Build materials for 3d printing
US-2026071067-A1 · Mar 12, 2026 · US
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Fong John patents
Fong John is listed as an inventor on 15 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Fong John |
| Total patents | 15 |
| First publication | Aug 2, 2018 |
| Latest publication | Mar 12, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Build materials for 3D printing
US-12497504-B2 · Dec 16, 2025 · US
Build materials for printing 3D articles
US-12129397-B2 · Oct 29, 2024 · US
Thiol-ene inks for 3D printing
US-11826925-B2 · Nov 28, 2023 · US
Build materials for printing 3d articles
US-2023357577-A1 · Nov 9, 2023 · US
Build materials for 3d printing
US-2023331974-A1 · Oct 19, 2023 · US
Build materials for printing 3D articles
US-11739221-B2 · Aug 29, 2023 · US
Build materials for 3D printing
US-11718743-B2 · Aug 8, 2023 · US
Build materials for printing 3d articles
US-2022154005-A1 · May 19, 2022 · US
3d printing ink containing a cyclopolymerizable monomer
US-2021403733-A1 · Dec 30, 2021 · US
Recent patents
Latest publications not already listed above.
3D printing ink containing a cyclopolymerizable monomer
US-11142660-B2 · Oct 12, 2021 · US
Thiol-ene inks for 3D printing
US-11090835-B2 · Aug 17, 2021 · US
Build materials for 3d printing
US-2021009800-A1 · Jan 14, 2021 · US
Biocompatible inks for 3D printing
US-10435573-B2 · Oct 8, 2019 · US
3d printing ink containing a cyclopolymerizable monomer
US-2018215933-A1 · Aug 2, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| 3D Systems Inc | 15 |
| 3D Systems Incorporated | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B33Y70/00 | 15 |
| B33Y10/00 | 15 |
| C09D11/101 | 11 |
| B29C64/124 | 9 |
| C09D11/107 | 8 |