Semiconductor arrangement, system and manufacturing method
US-2026033350-A1 · Jan 29, 2026 · US
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Fürgut Edward patents
Fürgut Edward is listed as an inventor on 24 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Fürgut Edward |
| Total patents | 24 |
| First publication | Jul 5, 2016 |
| Latest publication | Jan 29, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor packages including a package body with grooves formed therein
US-12512380-B2 · Dec 30, 2025 · US
Gate driver circuit and power switching assembly with gate driver circuit
US-12483232-B2 · Nov 25, 2025 · US
Semiconductor package including an encapsulant with a peripheral side wall having a recess and a lead disposed in the recess
US-2025357232-A1 · Nov 20, 2025 · US
Power Semiconductor Device Stack, Power Module, and Method of Producing a Power Semiconductor Device Stack
US-2025357454-A1 · Nov 20, 2025 · US
Application board and a semiconductor package mounted thereon for reducing creepage currents
US-2025323138-A1 · Oct 16, 2025 · US
Surface mount package having an internal redundant electrical connection
US-2025201682-A1 · Jun 19, 2025 · US
Package carrier with large back side area
US-2025118637-A1 · Apr 10, 2025 · US
Package with recess for balancing creepage current paths
US-2025038082-A1 · Jan 30, 2025 · US
Power Package With Galvanic Isolation
US-2025014971-A1 · Jan 9, 2025 · US
Recent patents
Latest publications not already listed above.
Leadframe comprising a lead with an elevation for increasing mechanical robustness and a semiconductor package
US-2024347427-A1 · Oct 17, 2024 · US
A semiconductor transistor package having electrical contact layers and a method for fabricating the same
US-2024266237-A1 · Aug 8, 2024 · US
Semiconductor package in a source-down configuration by use of vertical connectors
US-2024243092-A1 · Jul 18, 2024 · US
Silicon Carbide Device and Method for Forming a Silicon Carbide Device
US-2024113026-A1 · Apr 4, 2024 · US
Gate driver circuit and power switching assembly with gate driver circuit
US-2024113705-A1 · Apr 4, 2024 · US
Semiconductor Package or a Printed Circuit Board, Both Modified to One or More of Reduce, Inverse or Utilize Magnetic Coupling Caused by the Load Current of a Semiconductor Transistor
US-2024014104-A1 · Jan 11, 2024 · US
Electronic device module and a device module both having an adhesion promoter layer
US-2023378011-A1 · Nov 23, 2023 · US
Semiconductor package having an embedded electrical conductor connected between pins of a semiconductor die and a further device
US-2023361009-A1 · Nov 9, 2023 · US
Method for fabricating a semiconductor device module with increased reliability and a semiconductor device module
US-2023360929-A1 · Nov 9, 2023 · US
Semiconductor packages including a package body with grooves formed therein
US-2023298956-A1 · Sep 21, 2023 · US
Semiconductor package and a semiconductor device module including the same
US-2023282591-A1 · Sep 7, 2023 · US
Semiconductor die package
US-2023282608-A1 · Sep 7, 2023 · US
Chip arrangement, chip package, method of forming a chip arrangement, and method of forming a chip package
US-2023274996-A1 · Aug 31, 2023 · US
Electronic component with electronic chip between redistribution structure and mounting structure
US-9385111-B2 · Jul 5, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Austria Ag | 13 |
| Infineon Technologies Ag | 9 |
| Infineon Technologies Austria | 1 |
| Infineon Technologies Austria Ag | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/481 | 15 |
| H10W74/111 | 14 |
| H10W90/756 | 12 |
| H01L23/49562 | 10 |
| H10W74/01 | 10 |