Electronic component module
US-2023354528-A1 · Nov 2, 2023 · US
Doi Teppei is listed as an inventor on 10 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Doi Teppei |
| Total patents | 10 |
| First publication | Jun 2, 2016 |
| Latest publication | Nov 2, 2023 |
Publications ranked by popularity score, then publication date.
US-2023354528-A1 · Nov 2, 2023 · US
US-2023028542-A1 · Jan 26, 2023 · US
US-11309659-B2 · Apr 19, 2022 · US
US-2021288435-A1 · Sep 16, 2021 · US
US-10483738-B2 · Nov 19, 2019 · US
US-2019013657-A1 · Jan 10, 2019 · US
US-9742170-B2 · Aug 22, 2017 · US
US-2016308341-A1 · Oct 20, 2016 · US
US-9468121-B2 · Oct 11, 2016 · US
US-2016156162-A1 · Jun 2, 2016 · US
Latest publications not already listed above.
No data yet.
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Yazaki Corp | 10 |
| Toyota Motor Co Ltd | 5 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B60R16/0238 | 7 |
| H02G3/16 | 4 |
| H02G3/083 | 4 |
| B60R16/0239 | 3 |
| H01B7/0045 | 3 |