Optical cage assembly, optical module connector, and method for manufacturing optical cage assembly
US-12560772-B2 · Feb 24, 2026 · US
This page is not indexed by search engines while we improve data quality.
Deng Chaojun patents
Deng Chaojun is listed as an inventor on 20 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Deng Chaojun |
| Total patents | 20 |
| First publication | Sep 26, 2019 |
| Latest publication | Feb 24, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Chip package structure, preparation method, and electronic device
US-12341116-B2 · Jun 24, 2025 · US
Optical module housing and manufacturing method thereof, optical module, and optical communication device
US-2025189699-A1 · Jun 12, 2025 · US
Circuit board assembly and electronic device
US-12058803-B2 · Aug 6, 2024 · US
Circuit board assembly and electronic device
US-2024107656-A1 · Mar 28, 2024 · US
Optical Phased Board, Manufacturing Method, and Optical Phased Array System
US-2024085757-A1 · Mar 14, 2024 · US
Chip and manufacturing method thereof, and electronic device
US-11862529-B2 · Jan 2, 2024 · US
Circuit board assembly and electronic device
US-11805592-B2 · Oct 31, 2023 · US
Vertical interconnection structure and manufacturing method thereof, packaged chip, and chip packaging method
US-11776820-B2 · Oct 3, 2023 · US
Optical cage assembly, optical module connector, and method for manufacturing optical cage assembly
US-2023258890-A1 · Aug 17, 2023 · US
Recent patents
Latest publications not already listed above.
Chip for Manufacturing Chip, and Electronic Device
US-2022344238-A1 · Oct 27, 2022 · US
Heat dissipation structure, production method thereof, chip structure, and electronic device
US-2022344237-A1 · Oct 27, 2022 · US
Chip package structure, preparation method, and electronic device
US-2022216171-A1 · Jul 7, 2022 · US
Communications network and related device
US-11309967-B2 · Apr 19, 2022 · US
Vertical interconnection structure and manufacturing method thereof, packaged chip, and chip packaging method
US-2022102164-A1 · Mar 31, 2022 · US
Chip and manufacturing method thereof, and electronic device
US-2022102237-A1 · Mar 31, 2022 · US
Circuit board assembly and electronic device
US-2021212193-A1 · Jul 8, 2021 · US
Ultrasonic wave-based voice signal transmission system and method
US-10945068-B2 · Mar 9, 2021 · US
Communications Network and Related Device
US-2020343975-A1 · Oct 29, 2020 · US
Ultrasonic Wave-Based Voice Signal Transmission System and Method
US-2019297416-A1 · Sep 26, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Huawei Tech Co Ltd | 20 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G02B6/4269 | 7 |
| G02B6/4284 | 6 |
| H10W90/00 | 5 |
| H10W40/226 | 5 |
| H10W70/635 | 4 |