Semiconductor package manufacturing apparatus and semiconductor package manufacturing method using the same
US-12568788-B2 · Mar 3, 2026 · US
Cho Jun Ho is listed as an inventor on 19 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Cho Jun Ho |
| Total patents | 19 |
| First publication | Nov 17, 2016 |
| Latest publication | Mar 3, 2026 |
Publications ranked by popularity score, then publication date.
US-12568788-B2 · Mar 3, 2026 · US
US-12434829-B2 · Oct 7, 2025 · US
US-12401156-B2 · Aug 26, 2025 · US
US-2025147808-A1 · May 8, 2025 · US
US-2024092484-A1 · Mar 21, 2024 · US
US-11847867-B2 · Dec 19, 2023 · US
US-2023395404-A1 · Dec 7, 2023 · US
US-2023216240-A1 · Jul 6, 2023 · US
US-11265005-B2 · Mar 1, 2022 · US
US-11075845-B2 · Jul 27, 2021 · US
Latest publications not already listed above.
US-2021203343-A1 · Jul 1, 2021 · US
US-2021174606-A1 · Jun 10, 2021 · US
US-10404685-B2 · Sep 3, 2019 · US
US-2019166056-A1 · May 30, 2019 · US
US-10205669-B2 · Feb 12, 2019 · US
US-2017270516-A1 · Sep 21, 2017 · US
US-2017237674-A1 · Aug 17, 2017 · US
US-9647950-B2 · May 9, 2017 · US
US-2016337253-A1 · Nov 17, 2016 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Ebay Inc | 8 |
| Hyundai Autoever Corp | 3 |
| Lg Display Co Ltd | 2 |
| Hyundai Autron Co Ltd | 2 |
| Korea Aerospace Res Inst | 2 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H04L47/127 | 6 |
| H04L47/28 | 6 |
| H04L43/0894 | 6 |
| H04L47/11 | 6 |
| H04L47/24 | 6 |