Forming semiconductor chip package with a sacrifical layer
US-2026053044-A1 · Feb 19, 2026 · US
Chen Jiahui is listed as an inventor on 32 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chen Jiahui |
| Total patents | 32 |
| First publication | Aug 4, 2016 |
| Latest publication | Feb 19, 2026 |
Publications ranked by popularity score, then publication date.
US-2026053044-A1 · Feb 19, 2026 · US
US-12276581-B2 · Apr 15, 2025 · US
US-2023304901-A1 · Sep 28, 2023 · US
US-11450991-B2 · Sep 20, 2022 · US
US-11381012-B2 · Jul 5, 2022 · US
US-11355881-B2 · Jun 7, 2022 · US
US-11264753-B2 · Mar 1, 2022 · US
US-11201437-B2 · Dec 14, 2021 · US
US-11086090-B2 · Aug 10, 2021 · US
US-2021175667-A1 · Jun 10, 2021 · US
Latest publications not already listed above.
US-2021057837-A1 · Feb 25, 2021 · US
US-10931051-B2 · Feb 23, 2021 · US
US-10910778-B2 · Feb 2, 2021 · US
US-2020381841-A1 · Dec 3, 2020 · US
US-10790624-B2 · Sep 29, 2020 · US
US-2020251844-A1 · Aug 6, 2020 · US
US-2020227867-A1 · Jul 16, 2020 · US
US-2020209503-A1 · Jul 2, 2020 · US
US-2020203873-A1 · Jun 25, 2020 · US
US-10627584-B2 · Apr 21, 2020 · US
US-10623189-B2 · Apr 14, 2020 · US
US-2019305495-A1 · Oct 3, 2019 · US
US-2019288433-A1 · Sep 19, 2019 · US
US-2019280439-A1 · Sep 12, 2019 · US
US-10151882-B2 · Dec 11, 2018 · US
US-10142105-B2 · Nov 27, 2018 · US
US-2018278426-A1 · Sep 27, 2018 · US
US-9948462-B2 · Apr 17, 2018 · US
US-2018045892-A1 · Feb 15, 2018 · US
US-2018045900-A1 · Feb 15, 2018 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Tyco Electronics Shanghai Co Ltd | 23 |
| Univ South China Tech | 6 |
| Tyco Electronics Zhuhai Ltd | 2 |
| Univ Guangdong Ocean | 2 |
| Texas Instruments Inc | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01R13/502 | 10 |
| H01R24/50 | 10 |
| H01R13/2421 | 10 |
| H01R13/2407 | 8 |
| H01R12/714 | 7 |