Packaging structure
US-11462440-B2 · Oct 4, 2022 · US
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Chen Fu Cheng patents
Chen Fu Cheng is listed as an inventor on 12 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chen Fu Cheng |
| Total patents | 12 |
| First publication | May 31, 2018 |
| Latest publication | Oct 4, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
Image sensor with metal grids and manufacturing method thereof
US-10770498-B2 · Sep 8, 2020 · US
Packaging structure
US-2020258781-A1 · Aug 13, 2020 · US
Semiconductor structures and fabrication methods thereof
US-10685831-B2 · Jun 16, 2020 · US
Packaging structure and fabrication method thereof
US-10672662-B2 · Jun 2, 2020 · US
Wafer bonding methods and wafer-bonded structures
US-10446519-B2 · Oct 15, 2019 · US
Image sensor and manufacturing method thereof
US-2019067345-A1 · Feb 28, 2019 · US
Packaging structure and fabrication method thereof
US-2019035686-A1 · Jan 31, 2019 · US
Semiconductor structures and fabrication methods thereof
US-2018337038-A1 · Nov 22, 2018 · US
Wafer bonding structure and wafer bonding method
US-10121762-B2 · Nov 6, 2018 · US
Recent patents
Latest publications not already listed above.
Wafer bonding methods and wafer-bonded structures
US-2018269178-A1 · Sep 20, 2018 · US
Wafer bonding structure and wafer bonding method
US-2018151535-A1 · May 31, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Semiconductor Mfg Int Shanghai Corp | 11 |
| Semiconductor Mfg Int Beijing Corp | 11 |
| Semiconductor Mfg International (Shanghai) Corporation | 1 |
| Semiconductor Mfg International (Beijing) Corporation | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/0198 | 8 |
| H10W90/00 | 6 |
| H10W70/611 | 6 |
| H10W72/30 | 4 |
| H10W72/073 | 4 |