Lightweight photovoltaic module including a glass and polymer front layer
US-2024379886-A1 · Nov 14, 2024 · US
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Chambion Bertrand patents
Chambion Bertrand is listed as an inventor on 26 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chambion Bertrand |
| Total patents | 26 |
| First publication | Sep 17, 2015 |
| Latest publication | Nov 14, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Increasing the densification of solar modules by maximized superimposed interconnection
US-2024234606-A9 · Jul 11, 2024 · US
Increasing the densification of solar modules by maximized superimposed interconnection
US-2024136456-A1 · Apr 25, 2024 · US
Method for producing an assembly of solar cells overlapping via an interconnection structure
US-2024038915-A1 · Feb 1, 2024 · US
Process for collectively curving a set of electronic chips
US-11769785-B2 · Sep 26, 2023 · US
Wafer-level process for curving a set of electronic chips
US-11424286-B2 · Aug 23, 2022 · US
Method for manufacturing an electroluminescent device
US-11289359-B2 · Mar 29, 2022 · US
Method for producing a microelectronic chip to be hybridised to a second chip
US-11165005-B2 · Nov 2, 2021 · US
Method for producing curved electronic circuits
US-10991738-B2 · Apr 27, 2021 · US
Process for collectively curving a set of electronic chips
US-2021118940-A1 · Apr 22, 2021 · US
Recent patents
Latest publications not already listed above.
Method for manufacturing an electroluminescent device
US-2021090933-A1 · Mar 25, 2021 · US
Wafer-level process for curving a set of electronic chips
US-2021028222-A1 · Jan 28, 2021 · US
Integrated circuit intended for insulation defect detection and having a conductive armature
US-10845405-B2 · Nov 24, 2020 · US
Electronic structure comprising a matrix array of electronic devices having improved thermal performances
US-10820407-B2 · Oct 27, 2020 · US
Method for mass-production of curved electronic circuits
US-10658420-B2 · May 19, 2020 · US
Electronic circuit comprising electrically insulating trenches
US-10593588-B2 · Mar 17, 2020 · US
Method for producing a microelectronic chip to be hybridised to a second chip
US-2020058837-A1 · Feb 20, 2020 · US
Light emitting device
US-2020035864-A1 · Jan 30, 2020 · US
Integrated circuit intended for insulation defect detection and having a conductive armature
US-2019369157-A1 · Dec 5, 2019 · US
Method for mass-production of curved electronic circuits
US-2019371854-A1 · Dec 5, 2019 · US
Compensation of an arc curvature generated in a wafer
US-10483188-B2 · Nov 19, 2019 · US
Electronic structure comprising a matrix array of electronic devices having improved thermal performances
US-2019342987-A1 · Nov 7, 2019 · US
Method for producing curved electronic circuits
US-2019140008-A1 · May 9, 2019 · US
Compensation of an arc curvature generated in a wafer
US-2018366389-A1 · Dec 20, 2018 · US
Electronic circuit comprising electrically insulating trenches
US-2018366365-A1 · Dec 20, 2018 · US
Process for hybridizing by adhesive bonding two microelectronic elements
US-2015259197-A1 · Sep 17, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Commissariat Energie Atomique | 26 |
| Aledia | 2 |
| Renault Sa | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10H20/857 | 6 |
| H10H29/142 | 6 |
| H10H20/01 | 6 |
| H01L33/62 | 6 |
| H10F39/011 | 6 |