Two-dimensional high-entropy metal oxide assembly with high thermal conductivity and preparation method thereof
US-12410066-B2 · Sep 9, 2025 · US
Cai Weiwei is listed as an inventor on 12 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Cai Weiwei |
| Total patents | 12 |
| First publication | Mar 1, 2018 |
| Latest publication | Sep 9, 2025 |
Publications ranked by popularity score, then publication date.
US-12410066-B2 · Sep 9, 2025 · US
US-12098081-B2 · Sep 24, 2024 · US
US-2024010515-A1 · Jan 11, 2024 · US
US-11866343-B2 · Jan 9, 2024 · US
US-2022242745-A1 · Aug 4, 2022 · US
US-2022234908-A1 · Jul 28, 2022 · US
US-10638142-B2 · Apr 28, 2020 · US
US-10281554-B2 · May 7, 2019 · US
US-10229588-B2 · Mar 12, 2019 · US
US-2018268687-A1 · Sep 20, 2018 · US
Latest publications not already listed above.
US-2018131950-A1 · May 10, 2018 · US
US-2018059207-A1 · Mar 1, 2018 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Hangzhou Hikvision Digital Tec | 6 |
| Univ Zhejiang | 6 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C01P2002/52 | 6 |
| B82Y30/00 | 4 |
| C01P2004/64 | 4 |
| C01G31/006 | 4 |
| C01P2004/24 | 4 |