Equipment front end module for transferring wafers and method of transferring wafers
US-9818633-B2 · Nov 14, 2017 · US
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Bultman Gary patents
Bultman Gary is listed as an inventor on 2 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Bultman Gary |
| Total patents | 2 |
| First publication | Apr 21, 2016 |
| Latest publication | Nov 14, 2017 |
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/3402 | 2 |
| H10P72/3304 | 2 |
| H10P72/1904 | 2 |
| H10P72/33 | 2 |
| H01L21/67745 | 2 |