Trap rich layer with through-silicon-vias in semiconductor devices
US-9558951-B2 · Jan 31, 2017 · US
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Brindle Chris patents
Brindle Chris is listed as an inventor on 2 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Brindle Chris |
| Total patents | 2 |
| First publication | Dec 27, 2016 |
| Latest publication | Jan 31, 2017 |
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Qualcomm Inc | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/023 | 2 |
| H10W20/20 | 2 |
| H10W20/218 | 2 |
| H10D86/01 | 2 |
| H10D86/201 | 2 |