Online monitoring device and method for fouling and slagging based on capacitance principle differential measurement
US-12092599-B2 · Sep 17, 2024 · US
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Bi Dapeng patents
Bi Dapeng is listed as an inventor on 4 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Bi Dapeng |
| Total patents | 4 |
| First publication | Jul 1, 2021 |
| Latest publication | Sep 17, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Packaging structure and packaging method of digital circuit
US-11791232-B2 · Oct 17, 2023 · US
Online monitoring device and method for fouling and slagging based on capacitance principle differential measurement
US-2022155249-A1 · May 19, 2022 · US
Packaging structure and packaging method of digital circuit
US-2021202346-A1 · Jul 1, 2021 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Univ Taiyuan Technology | 2 |
| The 13Th Research Institute Of China Electronics Tech Group Corporation | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G01B7/08 | 2 |
| F23J2700/00 | 2 |
| F23J1/00 | 2 |
| F23G2900/55005 | 2 |
| G01N27/22 | 2 |