Power semiconductor module with vibration dampeners and power electronics system including the power semiconductor module
US-12463148-B2 · Nov 4, 2025 · US
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Bässler Marco patents
Bässler Marco is listed as an inventor on 8 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Bässler Marco |
| Total patents | 8 |
| First publication | Nov 9, 2023 |
| Latest publication | Nov 4, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Electronic Component With Reduced Inductance
US-2025246490-A1 · Jul 31, 2025 · US
Power semiconductor package having first and second lead frames
US-12211824-B2 · Jan 28, 2025 · US
Molded power semiconductor package
US-2024404925-A1 · Dec 5, 2024 · US
Power semiconductor device with a stress-free joint between metal parts and method for fabricating the same
US-2024332136-A1 · Oct 3, 2024 · US
Power semiconductor module with vibration dampeners and power electronics system including the power semiconductor module
US-2024266300-A1 · Aug 8, 2024 · US
Molded power semiconductor module and method for fabricating the same
US-2024047289-A1 · Feb 8, 2024 · US
Power semiconductor package having first and second lead frames
US-2023361088-A1 · Nov 9, 2023 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 8 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/114 | 6 |
| H10W90/811 | 6 |
| H01L23/49575 | 6 |
| H10W44/501 | 5 |
| H10W90/00 | 5 |