Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
US-2025022702-A1 · Jan 16, 2025 · US
This page is not indexed by search engines while we improve data quality.
Asai Masayuki patents
Asai Masayuki is listed as an inventor on 18 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Asai Masayuki |
| Total patents | 18 |
| First publication | Apr 9, 2015 |
| Latest publication | Jan 16, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
US-12142476-B2 · Nov 12, 2024 · US
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
US-2023298883-A1 · Sep 21, 2023 · US
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
US-11705325-B2 · Jul 18, 2023 · US
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
US-2023070910-A1 · Mar 9, 2023 · US
Method of processing substate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
US-11527401-B2 · Dec 13, 2022 · US
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
US-2020365388-A1 · Nov 19, 2020 · US
Substrate processing apparatus and semiconductor device manufacturing method
US-9963785-B2 · May 8, 2018 · US
Method of manufacturing semiconductor device, method of cleaning interior of process chamber, substrate processing apparatus, and recording medium
US-9895727-B2 · Feb 20, 2018 · US
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
US-2017087606-A1 · Mar 30, 2017 · US
Recent patents
Latest publications not already listed above.
Substrate processing apparatus and semiconductor device manufacturing method
US-9593422-B2 · Mar 14, 2017 · US
Mold and die metallic material, air-permeable member for mold and die use, and method for manufacturing the same
US-9545736-B2 · Jan 17, 2017 · US
Method for manufacturing semiconductor device, method for processing substrate, substrate processing device and recording medium
US-9502233-B2 · Nov 22, 2016 · US
Substrate processing apparatus and semiconductor device manufacturing method
US-9175395-B2 · Nov 3, 2015 · US
Method of manufacturing semiconductor device, cleaning method, substrate processing apparatus and non-transitory computer-readable recording medium
US-9145606-B2 · Sep 29, 2015 · US
Substrate processing apparatus and semiconductor device manufacturing method
US-2015197854-A1 · Jul 16, 2015 · US
Substrate processing apparatus and semiconductor device manufacturing method
US-2015197855-A1 · Jul 16, 2015 · US
Method for manufacturing semiconductor device, method for processing substrate, substrate processing device and recording medium
US-2015099373-A1 · Apr 9, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Hitachi Int Electric Inc | 12 |
| Kokusai Electric Corp | 7 |
| Asai Masayuki | 2 |
| Suzuki Mineo | 1 |
| Yabuno Tetsu | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P14/69433 | 16 |
| H10P14/6339 | 15 |
| H10P14/6336 | 14 |
| H10P14/6682 | 14 |
| C23C16/52 | 14 |