Via contact patterning method to increase edge placement error margin
US-11652045-B2 · May 16, 2023 · US
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An Seungdo patents
An Seungdo is listed as an inventor on 7 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | An Seungdo |
| Total patents | 7 |
| First publication | Aug 11, 2016 |
| Latest publication | May 16, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Integrated circuit interconnect structures including copper-free vias
US-2023143021-A1 · May 11, 2023 · US
Via contact patterning method to increase edge placement error margin
US-2022051975-A1 · Feb 17, 2022 · US
Via contact patterning method to increase edge placement error margin
US-11211324-B2 · Dec 28, 2021 · US
Via contact patterning method to increase edge placement error margin
US-2021082805-A1 · Mar 18, 2021 · US
Microfabricated gas flow structure
US-10794374-B2 · Oct 6, 2020 · US
Microfabricated gas flow structure
US-2016230751-A1 · Aug 11, 2016 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 5 |
| Univ Michigan Regents | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/056 | 5 |
| H10W20/42 | 5 |
| H01L21/76877 | 5 |
| H01L23/5226 | 5 |
| H10W20/435 | 5 |