Ceramic circuit board, manufacturing method for ceramic circuit board, and brazing material for circuit formation
US-2026068042-A1 · Mar 5, 2026 · US
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Patent family 98899111
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 98899111 |
| Family type | — |
| Earliest priority | Sep 2, 2024 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2026068042A1 — Ceramic circuit board, manufacturing method for ceramic circuit board, and brazing material for circuit formation |
Representative publication
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US2026068042A1 — Ceramic circuit board, manufacturing method for ceramic circuit board, and brazing material for circuit formation (published Mar 5, 2026)
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