Method for selective exposure of wafer to corrective irradiation at a per-die level
US-12529965-B2 · Jan 20, 2026 · US
This page is not indexed by search engines while we improve data quality.
Patent family 96501331
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 96501331 |
| Family type | — |
| Earliest priority | Jan 30, 2024 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US12529965B2 — Method for selective exposure of wafer to corrective irradiation at a per-die level |
Representative publication
Best representative member for this family based on priority and filing country.
US12529965B2 — Method for selective exposure of wafer to corrective irradiation at a per-die level (published Jan 20, 2026)
Member publications
Related publications in this family.