Resin composition, cured product, prepreg, metal foil-clad laminate, resin composite sheet, printed wiring board, and semiconductor device
US-2025257214-A1 · Aug 14, 2025 · US
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Patent family 88023721
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 88023721 |
| Family type | — |
| Earliest priority | Mar 14, 2022 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2025257214A1 — Resin composition, cured product, prepreg, metal foil-clad laminate, resin composite sheet, printed wiring board, and semiconductor device |
Representative publication
Best representative member for this family based on priority and filing country.
US2025257214A1 — Resin composition, cured product, prepreg, metal foil-clad laminate, resin composite sheet, printed wiring board, and semiconductor device (published Aug 14, 2025)
Member publications
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