Solder transfer integrated circuit packaging
US-2023230947-A1 · Jul 20, 2023 · US
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Patent family 84389933
This patent family groups 3 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 84389933 |
| Family type | — |
| Earliest priority | Jun 15, 2021 |
| First filing country | US |
| Member publications | 3 |
| Countries | US |
| Representative publication | US2023230947A1 — Solder transfer integrated circuit packaging |
Representative publication
Best representative member for this family based on priority and filing country.
US2023230947A1 — Solder transfer integrated circuit packaging (published Jul 20, 2023)
Member publications
Related publications in this family.
Solder transfer integrated circuit packaging
US-11631650-B2 · Apr 18, 2023 · US
Solder transfer integrated circuit packaging
US-2022399298-A1 · Dec 15, 2022 · US