Methods and materials for printing 3-dimensional structures with low density and high compressive strength
US-2025162195-A1 · May 22, 2025 · US
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 80445916 |
| Family type | — |
| Earliest priority | Feb 21, 2022 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2025162195A1 — Methods and materials for printing 3-dimensional structures with low density and high compressive strength |
Best representative member for this family based on priority and filing country.
US2025162195A1 — Methods and materials for printing 3-dimensional structures with low density and high compressive strength (published May 22, 2025)
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