Dip-coat binder solutions comprising a dip-coat metallic precursor for use in additive manufacturing
US-2024367231-A1 · Nov 7, 2024 · US
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Patent family 78332578
This patent family groups 3 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 78332578 |
| Family type | — |
| Earliest priority | Nov 9, 2020 |
| First filing country | US |
| Member publications | 3 |
| Countries | US |
| Representative publication | US2024367231A1 — Dip-coat binder solutions comprising a dip-coat metallic precursor for use in additive manufacturing |
Representative publication
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US2024367231A1 — Dip-coat binder solutions comprising a dip-coat metallic precursor for use in additive manufacturing (published Nov 7, 2024)
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