Lead-free and antimony-free solder alloy, solder ball, ball grid array, and solder joint
US-12447565-B2 · Oct 21, 2025 · US
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 78281049 |
| Family type | — |
| Earliest priority | Apr 30, 2020 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US12447565B2 — Lead-free and antimony-free solder alloy, solder ball, ball grid array, and solder joint |
Best representative member for this family based on priority and filing country.
US12447565B2 — Lead-free and antimony-free solder alloy, solder ball, ball grid array, and solder joint (published Oct 21, 2025)
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