Bonding wire for semiconductor devices
US-12581982-B2 · Mar 17, 2026 · US
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Patent family 77891749
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 77891749 |
| Family type | — |
| Earliest priority | Mar 25, 2020 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US12581982B2 — Bonding wire for semiconductor devices |
Representative publication
Best representative member for this family based on priority and filing country.
US12581982B2 — Bonding wire for semiconductor devices (published Mar 17, 2026)
Member publications
Related publications in this family.
Bonding wire for semiconductor devices
US-2023148306-A1 · May 11, 2023 · US