Polyamide compositions having high adhesion to metal and use thereof
US-2023391953-A1 · Dec 7, 2023 · US
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 75108556 |
| Family type | — |
| Earliest priority | Jan 29, 2021 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2023391953A1 — Polyamide compositions having high adhesion to metal and use thereof |
Best representative member for this family based on priority and filing country.
US2023391953A1 — Polyamide compositions having high adhesion to metal and use thereof (published Dec 7, 2023)
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