Heat insulation structure, substrate processing apparatus, method of manufacturing semiconductor device and substrate processing method
US-12456636-B2 · Oct 28, 2025 · US
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Patent family 74061581
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 74061581 |
| Family type | — |
| Earliest priority | Jun 27, 2019 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US12456636B2 — Heat insulation structure, substrate processing apparatus, method of manufacturing semiconductor device and substrate processing method |
Representative publication
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US12456636B2 — Heat insulation structure, substrate processing apparatus, method of manufacturing semiconductor device and substrate processing method (published Oct 28, 2025)
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