Layered sheet, electronic component packaging container, and electronic component packaging
US-11701874-B2 · Jul 18, 2023 · US
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 72942007 |
| Family type | — |
| Earliest priority | Apr 26, 2019 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US11701874B2 — Layered sheet, electronic component packaging container, and electronic component packaging |
Best representative member for this family based on priority and filing country.
US11701874B2 — Layered sheet, electronic component packaging container, and electronic component packaging (published Jul 18, 2023)
Related publications in this family.