Electrodeposition of nanotwinned copper structures
US-2022010446-A1 · Jan 13, 2022 · US
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Patent family 70464609
This patent family groups 1 related publication across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 70464609 |
| Family type | — |
| Earliest priority | Oct 31, 2018 |
| First filing country | US |
| Member publications | 1 |
| Countries | US |
| Representative publication | US2022010446A1 — Electrodeposition of nanotwinned copper structures |
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US2022010446A1 — Electrodeposition of nanotwinned copper structures (published Jan 13, 2022)
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