Welding method of demetallized ceramic substrate having surface capillary microgroove structure
US-12009270-B2 · Jun 11, 2024 · US
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Patent family 67575903
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 67575903 |
| Family type | — |
| Earliest priority | Apr 30, 2019 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US12009270B2 — Welding method of demetallized ceramic substrate having surface capillary microgroove structure |
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US12009270B2 — Welding method of demetallized ceramic substrate having surface capillary microgroove structure (published Jun 11, 2024)
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