Structural component, electronic apparatus, and fingerprint module assembly method
US-11393243-B2 · Jul 19, 2022 · US
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Patent family 66246162
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 66246162 |
| Family type | — |
| Earliest priority | Oct 27, 2017 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US11393243B2 — Structural component, electronic apparatus, and fingerprint module assembly method |
Representative publication
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US11393243B2 — Structural component, electronic apparatus, and fingerprint module assembly method (published Jul 19, 2022)
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