Depositing ruthenium layers in interconnect metallization
US-10731250-B2 · Aug 4, 2020 · US
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Patent family 64458771
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 64458771 |
| Family type | — |
| Earliest priority | Jun 6, 2017 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10731250B2 — Depositing ruthenium layers in interconnect metallization |
Representative publication
Best representative member for this family based on priority and filing country.
US10731250B2 — Depositing ruthenium layers in interconnect metallization (published Aug 4, 2020)
Member publications
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Depositing ruthenium layers in interconnect metallization
US-2018347041-A1 · Dec 6, 2018 · US