Methods of electrochemical deposition for void-free gap fill
US-2018171502-A1 · Jun 21, 2018 · US
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Patent family 62554638
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 62554638 |
| Family type | — |
| Earliest priority | Dec 15, 2016 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US2018171502A1 — Methods of electrochemical deposition for void-free gap fill |
Representative publication
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US2018171502A1 — Methods of electrochemical deposition for void-free gap fill (published Jun 21, 2018)
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Methods of electrochemical deposition for void-free gap fill
US-10000860-B1 · Jun 19, 2018 · US