Heat exchanger for dual-sided cooling of electronic modules
US-10600721-B2 · Mar 24, 2020 · US
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 62201595 |
| Family type | — |
| Earliest priority | Dec 14, 2016 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10600721B2 — Heat exchanger for dual-sided cooling of electronic modules |
Best representative member for this family based on priority and filing country.
US10600721B2 — Heat exchanger for dual-sided cooling of electronic modules (published Mar 24, 2020)
Related publications in this family.
US-10600721-B2 · Mar 24, 2020 · US
US-2018166357-A1 · Jun 14, 2018 · US