Formulations for chemical mechanical polishing pads and CMP pads made therewith
US-10208154-B2 · Feb 19, 2019 · US
This page is not indexed by search engines while we improve data quality.
Patent family 62192714
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 62192714 |
| Family type | — |
| Earliest priority | Nov 30, 2016 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10208154B2 — Formulations for chemical mechanical polishing pads and CMP pads made therewith |
Representative publication
Best representative member for this family based on priority and filing country.
US10208154B2 — Formulations for chemical mechanical polishing pads and CMP pads made therewith (published Feb 19, 2019)
Member publications
Related publications in this family.