Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board
US-10676579-B2 · Jun 9, 2020 · US
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Patent family 57686161
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 57686161 |
| Family type | — |
| Earliest priority | Jul 6, 2015 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10676579B2 — Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board |
Representative publication
Best representative member for this family based on priority and filing country.
US10676579B2 — Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board (published Jun 9, 2020)
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