Deposition of conformal films by atomic layer deposition and atomic layer etch
US-9502238-B2 · Nov 22, 2016 · US
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 57016250 |
| Family type | — |
| Earliest priority | Apr 3, 2015 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US9502238B2 — Deposition of conformal films by atomic layer deposition and atomic layer etch |
Best representative member for this family based on priority and filing country.
US9502238B2 — Deposition of conformal films by atomic layer deposition and atomic layer etch (published Nov 22, 2016)
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