Method for manufacturing electronic device comprising a resin substrate and an electronic component
US-9397001-B2 · Jul 19, 2016 · US
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Patent family 56111881
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 56111881 |
| Family type | — |
| Earliest priority | Dec 11, 2014 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US9397001B2 — Method for manufacturing electronic device comprising a resin substrate and an electronic component |
Representative publication
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US9397001B2 — Method for manufacturing electronic device comprising a resin substrate and an electronic component (published Jul 19, 2016)
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