Integrated circuit packaging techniques and configurations for small form-factor or wearable devices
US-9646953-B2 · May 9, 2017 · US
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Patent family 55930373
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 55930373 |
| Family type | — |
| Earliest priority | Nov 12, 2014 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US9646953B2 — Integrated circuit packaging techniques and configurations for small form-factor or wearable devices |
Representative publication
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US9646953B2 — Integrated circuit packaging techniques and configurations for small form-factor or wearable devices (published May 9, 2017)
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