Resin composition for printed circuit board, prepreg for printed circuit board, laminate, metal-clad laminate, printed circuit board, and magnesium oxide, and method for manufacturing magnesium oxide
US-9468097-B2 · Oct 11, 2016 · US
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Patent family 54837366
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 54837366 |
| Family type | — |
| Earliest priority | Jun 16, 2014 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US9468097B2 — Resin composition for printed circuit board, prepreg for printed circuit board, laminate, metal-clad laminate, printed circuit board, and magnesium oxide, and method for manufacturing magnesium oxide |
Representative publication
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US9468097B2 — Resin composition for printed circuit board, prepreg for printed circuit board, laminate, metal-clad laminate, printed circuit board, and magnesium oxide, and method for manufacturing magnesium oxide (published Oct 11, 2016)
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