Method for evaluating internal stress of silicon carbide monocrystalline wafer and method for predicting warpage in silicone carbide monocrystalline wafer
US-10031089-B2 · Jul 24, 2018 · US
This page is not indexed by search engines while we improve data quality.
Patent family 52688558
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 52688558 |
| Family type | — |
| Earliest priority | Sep 20, 2013 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10031089B2 — Method for evaluating internal stress of silicon carbide monocrystalline wafer and method for predicting warpage in silicone carbide monocrystalline wafer |
Representative publication
Best representative member for this family based on priority and filing country.
US10031089B2 — Method for evaluating internal stress of silicon carbide monocrystalline wafer and method for predicting warpage in silicone carbide monocrystalline wafer (published Jul 24, 2018)
Member publications
Related publications in this family.